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NVIDIA Jetson Developer System

  • Y-C11-DEV Developer System
  • Y-C11-DEV Developer System
  • Y-C11-DEV Developer System
  • Y-C11-DEV Developer System
Y-C11-DEV Developer SystemY-C11-DEV Developer SystemY-C11-DEV Developer SystemY-C11-DEV Developer System

Y-C11-DEV Developer System

NVIDIA Jetson Orin NX/Orin Nano module
Size:120mm*108mm*36mm
Weight:188g
Temperature:-25~+70°C
Power Supply:DC +12V~+24V


Y-C11-DEV developer system for NVIDIA Jetson Orin NX and NVIDIA Jetson Orin Nano modules.
Among them, Y-C11 carrier board adopts wide temperature industrial model, the main interface is designed for electrostatic safety protection, and the power supply application scheme of high reliability is adopted. The input power supply has the function of overvoltage and reverse polarity protection, and has a rich external interface. It can carry hundreds of functional modules through MiniPCIe connector (including USB2.0 and PCIe X1 signals) to achieve further expansion of system functions. The M.2 B key slot of the Y-C11 carrier board can directly carry 4G/5G communication modules, and the carrier board has a Nano SIM card slot. Both independent and dual gigabit network ports support expanded POE power supply.


NVIDIA Jetson Orin NX/Orin Nano module
Size:120mm*108mm*36mm
Weight:188g
Temperature:-25~+70°C
Power Supply:DC +12V~+24V



NVIDIA Jetson Orin NX/Orin Nano module

Technical Specification


Jetson Orin NX 16GB
Jetson Orin NX 8GB
Jetson Orin Nano 8GB
Jetson Orin Nano 4GB
AI Performance
100 TOPS
70 TOPS
40 TOPS
20 TOPS
GPU 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores
CPU 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU2MB L2 + 4MB L3
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU1.5MB L2 + 4MB L3
Memory 16GB 128-bit LPDDR5
102.4GB/s
8GB 128-bit LPDDR5
102.4GB/s
8GB 128-bit LPDDR5
68 GB/s
4GB 64-bit LPDDR5
34 GB/s

Storage

-
(Supports external NVMe)
Video Encode
1x 4K60 (H.265)
3x 4K30 (H.265)
6x 1080p60 (H.265)
12x 1080p30 (H.265)
1080p30 supported by 1-2 CPU cores

Video Decode

1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
1x 4K60 (H.265)
2x 4K30 (H.265)
5x 1080p60 (H.265)
11x 1080p30 (H.265)

CSI Camera

Up to 4 cameras (8 via virtual channels***)
8 lanes MIPI CSI-2
D-PHY 2.1 (up to 20Gbps)
Up to 4 cameras (8 via virtual channels***)
8 lanes MIPI CSI-2
D-PHY 2.1 (up to 20Gbps)

PCIe

1 x4 + 3 x1
(PCIe Gen4, Root Port, & Endpoint)
1 x4 + 3 x1
(PCIe Gen3, Root Port, & Endpoint)
USB 3x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0
3x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0

Networking

1x GbE
Display 1x 8K30 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
1x 4K30 multi-mode DP 1.2 (+MST)/eDP 1.4/HDMI 1.4**
Other I/O 3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs
3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs
PowerPower 10W - 25W
10W - 20W
7W - 15W
7W - 10W
Mechanical
69.6mm x 45mm
260-pin SO-DIMM connector

The top view of Y-C11 carrier board

The bottom view of Y-C11 carrier board