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NVIDIA Jetson Developer System

  • Y-C11-DEV Developer System
  • Y-C11-DEV Developer System
  • Y-C11-DEV Developer System
Y-C11-DEV Developer SystemY-C11-DEV Developer SystemY-C11-DEV Developer System

Y-C11-DEV Developer System

NVIDIA Jetson Orin NX/Orin Nano module
Size：120mm*108mm*36mm
Weight：188g
Temperature：-25~+70°C
Power Supply：DC +12V～+24V


NVIDIA Jetson Orin Nano/Orin NX
Y-C11 DevKit


Feature


* NVIDIA Jetson Carrier Board:
Support NVIDIA Jetson Orin NX/Orin Nano Module

* Versatile Connectivity:
Offer 2x Gigabit Ethernet (10/100/1000 BASE-T) RJ45 connector (extensible support POE power supply), 4x USB 3.0, 1x Micro USB, 1x HDMI Type-A and 1x Nano SIM

* Advanced Peripherals Supported:
Assemble 1x fan, 2x M.2 2242 M key, 1x M. 2 3050 B key slot (for 4G/5G module), 2x 4 Lane MIPI camera interface FPC connector, 2x 20 pin 2.0mm spacing multi-function extension pin connector (including 4x GPIO, 2x I2C, 2x SPI, 1x I2S, 2x UART)

* Input Power: DC + 12V ~ + 24V

* Compact and Durable during Operation:
Design in small size of 120mm*102mm*36mm to save operation space, and maintain function in the temperature range from -20°C to 65℃
Application
* Robots and robotics
* Unmanned boats/cars
* Industrial automation
* V2X
* IoT (Internet of Things) and embedded systems
* Education and prototyping projects
Product Name
Y-C11-DEV
Jetson Module Supported
NVIDIA Jetson Orin Nano/Orin NX
Networking
2x Gigabit Ethernet (10/100/1000)
USB
4x USB 3.0
1x Micro USB
Camera
2x 4 Lane MIPI camera interface FPC connector
Display
1x HDMI
FAN
1x FAN connector
M.2 KEY M
2x M.2 KEY M interface
Other I/O
1x CAN, 4x GPIO, 2x I2C, 2x SPI, 1x I2S, 1x UART
Mechanical
120mm x 102mm x 36mm
Weight
188g
Operating Temperature
-20℃~65℃



NVIDIA Jetson Orin NX/Orin Nano module

Technical Specification


Jetson Orin NX 16GB
 Jetson Orin NX 8GB
 Jetson Orin Nano 8GB
 Jetson Orin Nano 4GB
AI Performance
 100 TOPS
 70 TOPS
 40 TOPS
 20 TOPS
GPU 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores
CPU 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU2MB L2 + 4MB L3
 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU1.5MB L2 + 4MB L3
Memory 16GB 128-bit LPDDR5
102.4GB/s
 8GB 128-bit LPDDR5
102.4GB/s
 8GB 128-bit LPDDR5
68 GB/s
 4GB 64-bit LPDDR5
34 GB/s

Storage

-
(Supports external NVMe)
Video Encode
 1x 4K60 (H.265)
3x 4K30 (H.265)
6x 1080p60 (H.265)
12x 1080p30 (H.265)
 1080p30 supported by 1-2 CPU cores

Video Decode

1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
 1x 4K60 (H.265)
2x 4K30 (H.265)
5x 1080p60 (H.265)
11x 1080p30 (H.265)

CSI Camera

Up to 4 cameras (8 via virtual channels***)
8 lanes MIPI CSI-2
D-PHY 2.1 (up to 20Gbps)
 Up to 4 cameras (8 via virtual channels***)
8 lanes MIPI CSI-2
D-PHY 2.1 (up to 20Gbps)

PCIe

1 x4 + 3 x1
(PCIe Gen4, Root Port, & Endpoint)
 1 x4 + 3 x1
(PCIe Gen3, Root Port, & Endpoint)
USB 3x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0
 3x USB 3.2 Gen2 (10 Gbps)
3x USB 2.0

Networking

1x GbE
Display 1x 8K30 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
 1x 4K30 multi-mode DP 1.2 (+MST)/eDP 1.4/HDMI 1.4**
Other I/O 3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs
 3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs
PowerPower 10W - 25W
 10W - 20W
 7W - 15W
 7W - 10W
Mechanical
 69.6mm x 45mm
260-pin SO-DIMM connector

The top view of Y-C11 carrier board

The bottom view of Y-C11 carrier board



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