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Y-C11-DEV developer system for NVIDIA Jetson Orin™ NX and NVIDIA Jetson Orin Nano modules.
Among them, Y-C11 carrier board adopts wide temperature industrial model, the main interface is designed for electrostatic safety protection, and the power supply application scheme of high reliability is adopted. The input power supply has the function of overvoltage and reverse polarity protection, and has a rich external interface. It can carry hundreds of functional modules through MiniPCIe connector (including USB2.0 and PCIe X1 signals) to achieve further expansion of system functions. The M.2 B key slot of the Y-C11 carrier board can directly carry 4G/5G communication modules, and the carrier board has a Nano SIM card slot. Both independent and dual gigabit network ports support expanded POE power supply.
NVIDIA Jetson Orin NX/Orin Nano module
Size：120mm*108mm*36mm
Weight：188g
Temperature：-25~+70°C
Power Supply：DC +12V～+24V
NVIDIA Jetson Orin NX/Orin Nano module
Technical Specification
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Jetson Orin NX 16GB |
Jetson Orin NX 8GB |
Jetson Orin Nano 8GB |
Jetson Orin Nano 4GB |
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AI Performance |
100 TOPS |
70 TOPS |
40 TOPS |
20 TOPS |
| GPU |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
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| CPU |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU2MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU1.5MB L2 + 4MB L3 |
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| Memory |
16GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 68 GB/s |
4GB 64-bit LPDDR5 34 GB/s |
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Storage |
- (Supports external NVMe) |
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Video Encode |
1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) |
1080p30 supported by 1-2 CPU cores |
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Video Decode |
1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) |
1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) |
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CSI Camera |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
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PCIe |
1 x4 + 3 x1 (PCIe Gen4, Root Port, & Endpoint) |
1 x4 + 3 x1 (PCIe Gen3, Root Port, & Endpoint) |
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| USB |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
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Networking |
1x GbE |
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| Display |
1x 8K30 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
1x 4K30 multi-mode DP 1.2 (+MST)/eDP 1.4/HDMI 1.4** |
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| Other I/O |
3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs |
3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs |
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| PowerPower |
10W - 25W |
10W - 20W |
7W - 15W |
7W - 10W |
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Mechanical |
69.6mm x 45mm 260-pin SO-DIMM connector |
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The top view of Y-C11 carrier board 
The bottom view of Y-C11 carrier board