On September 18, 2025, the Huawei Connect Conference (HC 2025), themed “Accelerating Industry Intelligence,” officially opened at the Shanghai World Expo Center.

During the conference, the Ascend AI Artificial Intelligence Industry Summit, themed “With the Times, Ascend Together,” was successfully held, showcasing the latest technological achievements and innovations across Ascend’s full-stack capabilities, from foundational hardware and software to industry solutions. As a Huawei Ascend hardware partner, Pinli Technology was honored to participate in and witness this grand event in the computing industry.

▲ Pinli Technology releases industrial-grade dual-chip edge intelligence box

▲ Pinli edge intelligence boxes and 8-module rugged servers showcased in the computing exhibition area

At the summit, Huawei officially unveiled its Ascend computing product roadmap for the next three years. The Ascend 950PR, scheduled for release in Q1 2026, will adopt Huawei’s self-developed HBM (High Bandwidth Memory). With significantly enhanced compute power and interconnect bandwidth, it is expected to provide more efficient solutions for large-scale model training and distributed inference.

As a strategic partner of Huawei Ascend, Pinli Technology delivers domestically developed AI computing hardware solutions based on Ascend chips. Its product portfolio spans VPX compute cards, modules, carrier boards, development kits, and edge intelligence boxes, supported by comprehensive technical services. These products have been widely deployed across computing-intensive scenarios in transportation, energy, manufacturing, healthcare, education, and more.

Looking ahead, Pinli Technology will continue to deepen its collaboration with Huawei Ascend, leveraging domestic computing power as a catalyst to accelerate intelligent upgrades across industries, expand AI adoption across all scenarios, and co-create a new blueprint for an intelligent world.