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Y-C17-DEV是基于NVIDIA Jetson Xavier™ NX、NVIDIA Jetson ORIN™ NX和NVIDIA Jetson ORIN™ NANO模块驱动的Plink AI自研开发系统。所有元器件均为宽温型，具有多种外部接口。通过MiniPCIe连接器(包括USB 2.0和PCIe X1信号)可承载数百个功能模块，实现系统功能的进一步扩展。Y-C17载板M.2 B Key插槽可直接承载4G/5G通信模块，载板自带Nano SIM卡槽。
2 x Type-C连接器
1 x Nano型SIM卡连接器
1 x 全长MiniPCIe连接器
1 x M.2 2230 M key槽位
1 x M.2 3050 B key槽位(可扩展4G/5G通信模块)
1x2 Lane MIPI相机接口FPC连接器
1 x 3.3V RTC供电接口
1 x风扇控制接口(5V)
上电自动开机
防脱落电源接线端子
板卡尺寸:85mm * 63mm * 35mm
电源输入:DC +12V~+24V
工作温度:-25 ~ +65°C
重量:125g
载板接口展示
NVIDIA Jetson Orin NX与NVIDIA Jetson Orin Nano模组参数
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Jetson Orin NX 16GB |
Jetson Orin NX 8GB |
Jetson Orin Nano 8GB |
Jetson Orin Nano 4GB |
Jetson Xavier NX 16GB |
Jetson Xavier NX 8GB |
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AI Perf |
100 TOPS |
70 TOPS |
40 TOPS |
20 TOPS |
21 TOPS |
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GPU |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
384-core NVIDIA Volta™ architecture GPU with 48 Tensor Cores |
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CPU |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core NVIDIA Carmel Arm®v8.2 64-bit CPU 6MB L2 + 4MB L3 |
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Memory |
16GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 68 GB/s |
4GB 64-bit LPDDR5 34 GB/s |
16GB 128-bit LPDDR4x 59.7GB/s |
8GB 128-bit LPDDR4x 59.7GB/s |
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Storage |
- (Supports external NVMe) |
16GB eMMC 5.1 |
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Video Encode |
1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) |
1080p30 supported by 1-2 CPU cores |
2x 4K60 (H.265) 4x 4K30 (H.265) 10x 1080p60 (H.265) 22x 1080p30 (H.265) |
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Video Decode |
1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) |
1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) |
2x 8K30 (H.265) 6x 4K60 (H.265) 12x 4K30 (H.265) 22x 1080p60 (H.265) 44x 1080p30 (H.265) |
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CSI Camera |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
Up to 6 cameras (24 via virtual channels) 14 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) |
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PCIe |
1 x4 + 3 x1 (PCIe Gen4, Root Port, & Endpoint) |
1 x4 + 3 x1 (PCIe Gen3, Root Port, & Endpoint) |
1 x4 (PCIe Gen4) + 1 x1 (PCIe Gen3) |
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USB |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
1x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
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Power |
10W - 25W |
10W - 20W |
7W - 15W |
7W - 10W |
10W - 20W |
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| Mechanical |
69.6mm x 45mm 260-pin SO-DIMM connector |
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